Keywords
Citation
(1999), "IPC translates Japanese technology roadmap", Circuit World, Vol. 25 No. 2. https://doi.org/10.1108/cw.1999.21725bab.015
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
IPC translates Japanese technology roadmap
Asia
IPC translates Japanese technology roadmap
Keywords Asia, Japan, JPCA, Printed circuit boards
The trend to decrease product size in the electronics industry is expected to continue over the next five years, with weight and size forecast to reduce 40-60 per cent. That is according to the Japan Printed Circuit Association Report on the Technology Roadmap for Advanced System Integration and Packaging, which IPC, Association Connecting Electronics Industries, recently translated into English.
This roadmap was created "to define clearly the current state of electronic packaging technologies and to investigate the trends in technology that will characterize the environment for the next generation of circuit packaging technologies", says JPCA chairman Masaru Endoh.
The 11-chapter, 432-page roadmap discusses the printed wiring board (PWB) business industry in Japan and Asia as well as future market and technology trends through the year 2005, including forecasts on semiconductors, SMT components, materials, PWBs, component mounting, design and packaging. It includes forecasts on expected requirements for portable computers, PC cards, mobile communications, personal digital assistants (PDAs) and IC cards.
JPCA created its roadmap using the results of a detailed questionnaire, which was written by representatives of IBM Japan Ltd, Sony Corporation, Toshiba Corporation and Fujitsu Ltd. The survey was sent out to OEMs, semiconductor component manufacturers, IC package manufacturers, component manufacturers, PWB manufacturers and package processors. Those who participated in the survey answered questions about current conditions and where they expect the industry to be in the next three years and in the next five years.
Submitted information was used by the JPCA to make projections about future trends in the industry. The document contains over 100 data tables and figures to make the information easy to understand. Some other predictions made in the roadmap:
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Thickness for all products to be reduced by 25-45 per cent.
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Size for products which portability is of paramount importance is to be reduced 40 per cent.
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Color imaging will be added to portable telephones and personal handy phone systems (PHS).
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Color motion imaging and voice function will be added to pagers, PDAs and other character/image data devices in a trend towards full multimedia.
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Product development cycle time expected to fall 30-50 per cent.
The JPCA Roadmap was originally published in Japanese in June 1998, and it has been translated into English with JPCA's permission. Copies are available for $195 to IPC members and $500 for non-members through the IPC Order Department at +1 (847) 509 9700.