MIL-STD-1553 terminal is radiation hardened to survive 1 MRad dose

MIL-STD-1553 terminal is radiation hardened to survive 1 MRad dose

MIL-STD-1553 terminal is radiation hardened to survive 1 MRad dose

DDC has announced the availability of the BU-61582, a radiation hardened version of its advanced communications engine (ACE) MIL-STD-1553 data bus terminal. The BU-61582 survives 1 MRad total dose, has no more than 10^­7 errors/bit-day single event upsets and is latch-up immune.

Data Devices Corporation (DDC) has announced a radiation hardened version of its ACE MIL-STD-1553 data bus terminal

Commonly referred to as the "Space ACE" (SP'ACE), the BU-61582 is intended for use on launch vehicles, satellites, space stations, the space shuttle and other interstellar vehicles.

While the MIL-STD-1553 serial data bus was primarily developed for military avionic use, it is now widely used in space applications. However the additional requirements of radiation hardness mean that special attention has to be paid to the product's process technology.

The device is fabricated in Honeywell's 0.8 micron RICMOS (Radiation Insensitive CMOS) process and uses DDC's proprietary J-RADprotocol chip and a 16k × 16 internal RAM.

The BU-61582 brings the full range of features of DDC's ACE technology to customers requiring radiation tolerance and higher reliability characteristics.

The BU-61582 SP'ACE claims to retain all of the flexibility of DDC's ACE family, including the ability to be configured as a bus controller (BC), remote terminal (RT) or monitor terminal (MT). It is available with or without DDC's Mark II bipolar transceivers in voltage options of +5V/­15V, +5V/­12V.

The SP'ACE is available in a variety of reliability levels, ranging from Class H to Class K (formerly known as Class S ­ "full" space-level), the highest quality level defined in MIL-PRF-38534. Class K includes extensive element evaluation, including l,000-hour life testing, scanning electron microscope (SEM) inspection of integrated circuits, 100-per cent non-destructive wire bond pull testing, particle impact noise detection (PIND) testing, radiographic (X-ray) inspection and 320 hours of burn-in. These procedures are all in addition to standard Class H processing. Various interim screening levels are also available to satisfy specific program requirements.

Package choices are 70-pin DIP, 70-pin flat pack or 196-pin ceramic quad flat pack.

Details from Data Device Corporation (DDC). Tel: +44 (0) 1635-40158; Fax: +44 (0) 1635-32264.