Method for Paste Selection and Process Optimisation for Fine‐pitch SMT

This paper outlines a methodology of paste selection for fine‐pitch SMT using a sequential investigation process including Design of Experiments (DoE) techniques. Several factors including SMT machine parameters as well as environmental conditions were investigated as to their effect on the soldering process. Materials and processes were selected for optimum performance. This resulted in the development of a robust fine‐pitch SMT process for the Hewlett Packard (hp) Medical Equipment Group in Andover, Massachusetts.