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Wafer prealigning robot based on shape center calculation

Z. Fu (State Key Laboratory of Mechanical System and Vibration, Shanghai Jiaotong University, Shanghai, People‘s Republic of China)
C.X. Huang (State Key Laboratory of Mechanical System and Vibration, Shanghai Jiaotong University, Shanghai, People‘s Republic of China)
R.Q. Liu (State Key Laboratory of Mechanical System and Vibration, Shanghai Jiaotong University, Shanghai, People‘s Republic of China)
Y.Z. Zhao (State Key Laboratory of Mechanical System and Vibration, Shanghai Jiaotong University, Shanghai, People‘s Republic of China)
Q.X. Cao (State Key Laboratory of Mechanical System and Vibration, Shanghai Jiaotong University, Shanghai, People‘s Republic of China)

Industrial Robot

ISSN: 0143-991x

Article publication date: 17 October 2008

273

Abstract

Purpose

The aim of this paper is to provide a new wafer prealigning robot for the photo‐etching facility during the manufacturing of IC products.

Design/methodology/approach

The shape center is measured by a reflection‐style laser sensor in the wafer's radial direction, and the position is measured by a penetration‐style laser sensor. A dynamic error compensation is applied to eliminate the radial runout and wobble of the rotary stage, which have effects on the measurement of the wafer's shape center.

Findings

It is found that the new wafer prealigning robot can satisfy the accuracy requirement.

Research limitations/implications

The robot requires that the shape center can be accurately calculated.

Practical implications

The robot is applicable to wafer prealigning for the photo‐etching facility.

Originality/value

A wafer prealigning robot based on the shape center calculation method has been developed and is described in the paper.

Keywords

Citation

Fu, Z., Huang, C.X., Liu, R.Q., Zhao, Y.Z. and Cao, Q.X. (2008), "Wafer prealigning robot based on shape center calculation", Industrial Robot, Vol. 35 No. 6, pp. 536-540. https://doi.org/10.1108/01439910810909538

Publisher

:

Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited

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