* Corresponding authors

^a School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China
E-mail: zhenlong@uestc.edu.cn, linyuan@uestc.edu.cn

^b Shenzhen Institute for Advanced Study, University of Electronic Science and Technology of China, Shenzhen 518110, Guangdong, China

^c State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China

^d Research Centre for Information Technology, Shenzhen Institute of Information Technology, Shenzhen 518172, Guangdong, China