Issue 11, 2014
From the journal:

Nanoscale

All metal nanoelectromechanical switch working at 300 °C for rugged electronics applications†

You Qian,ab   Bo Woon Soon,ab   Pushpapraj Singh,b   Humberto Campanellab  and  Chengkuo Lee*a  

* Corresponding authors

a Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117576
E-mail: elelc@nus.edu.sg

b Institute of Microelectronics, Agency for Science, Technology and Research (A*STAR), 11 Science Park Road, Singapore Science Park II, Singapore 117685

Abstract

An all metal based electrostatic nanoelectromechanical switch has been fabricated using a one mask process. High temperature cycling behavior is demonstrated in a vacuum chamber at 300 °C for more than 28 hours. The compelling results indicate that the design is promising for the realization of rugged electronics with three-dimensional integration.

Graphical abstract: All metal nanoelectromechanical switch working at 300 °C for rugged electronics applications

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Article information

DOI
https://doi.org/10.1039/C3NR05255A
Article type
Communication
Submitted
02 Oct 2013
Accepted
25 Feb 2014
First published
17 Apr 2014

Nanoscale, 2014,6, 5606-5611

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All metal nanoelectromechanical switch working at 300 °C for rugged electronics applications

Y. Qian, B. W. Soon, P. Singh, H. Campanella and C. Lee, Nanoscale, 2014, 6, 5606 DOI: 10.1039/C3NR05255A

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