Abstracts
The formation conditions of a smooth and oxide-free surface of InSb semiconductor with the purpose of fabricating lateral spin devices based on it are investigated. The dry etching rate by Ar ions of the surface of the crystalline faces (100) of InSb plates as well as a variation in their roughness depending on the power supplied to ion etching devices are investigated. The degree of oxidation of the semiconductor surface exposed to air after ion cleaning and annealing in molecular hydrogen are evaluated. Based on comparison of the efficiency of spin injection in devices formed with semiconductors subjected to various types of treatment, a conclusion is made about the parameters of optimal preparation of the surface of the InSb wafers for the fabrication of lateral spin devices.
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ACKNOWLEDGMENTS
This study was supported by the Federal Agency for Science and Education, theme “Spin”, no. AAAA-A18-118020290104-2; by the Ministry of Education and Science of the Russian Federation, project no. 14.Z50.31.0025, and by the Russian Foundation for Basic Research, project no. 16-02-00044.
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Translated by N. Korovin
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Viglin, N.A., Gribov, I.V., Tsvelikhovskaya, V.M. et al. Oxide Removal from the InSb Plate Surface to Produce Lateral Spin Valves. Semiconductors 53, 264–267 (2019). https://doi.org/10.1134/S1063782619020258
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DOI: https://doi.org/10.1134/S1063782619020258