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Wettability of SACR–xNi solder alloy on Cu leading wire with no-clean flux

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Abstract

The wettability of SACR lead-free solder alloy on the surface of Cu leading wire with tiny Ni addition and different soldering parameters by adopting commercial no-clean flux was investigated by means of wetting balance methods. Obtained results show that the SACR–xNi solder alloy has better wetting match proprieties on the surface of Φ0.6 × 30 mm Cu leading wire with the addition of 0.1 % Ni at soldering temperature of 255 °C, soldering time of 4 s, dipping speed of 20 mm/s and dipping depth of 3 mm, i.e. it has higher wetting force, smaller wetting angle and shorter wetting time. The wettability can meet the standard to the lead-free solders of surface mount technology industry.

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Acknowledgments

This work was supported by the program for Innovation Scientists and Technicians Troop Construction Projects of Henan Province under Grant No. 154200510022 and Innovative Research Team in Science and Technology in Henan Province under Grant No. 13IRTSTHN003.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China

    Yaoli Wang, Ning Ma & Keke Zhang

  2. Collaborative Innovation Center of Nonferrous Metals, Luoyang, 471023, Henan, China

    Yaoli Wang

  3. Citic Heavy Industry Co., LTD, Luoyang, 471003, China

    Zonghui Fang

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  1. Yaoli Wang
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  2. Zonghui Fang
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Correspondence to Yaoli Wang.

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Wang, Y., Fang, Z., Ma, N. et al. Wettability of SACR–xNi solder alloy on Cu leading wire with no-clean flux. J Mater Sci: Mater Electron 28, 94–99 (2017). https://doi.org/10.1007/s10854-016-5496-z

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  • DOI: https://doi.org/10.1007/s10854-016-5496-z

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