Abstract
Copper sulfide (CuS) thin film was electrodeposited onto stainless steel (SS 316L) substrate under pulse potential control, from an aqueous acidic solution containing 10−3 M of CuSO4.5H2O and 10−2 M of SC(NH2)2. The solution pH was maintained at 2.2 ± 0.1 by adding a few microliters of 0.1 M H2SO4 solution. The electrodeposited thin film was grown at 30 °C by applying a forward potential (EF) of − 0.85 V vs Ag/AgCl for 0.2 s and a reverse potential (ER) of 0 V vs Ag/AgCl for 0.4 s. Cyclic voltammetry (CV) was used to determine EF and ER as well as the possible reactions that occurred in the studied system and to understand the electrochemical behavior of the SS 316 L substrate on the deposition solutions. Normal and grazing incidence X-ray diffraction (XRD), Raman spectroscopy, and energy-dispersive analysis of X-ray (EDAX) techniques showed that the obtained thin film, applying EF and ER, was a hexagonal covellite CuS. Scanning electron microscopy (SEM) analysis showed that the obtained CuS film is grainy and contained some cracks. Profilometry indicated that the elaborated film has a thickness of 7.85 ± 0.71 µm. Electrochemical impedance spectroscopy (EIS) and Mott–Schottky (MS) analysis were performed, but the results are controversial because of the participation of SS 316 L substrate in the behavior of the obtained data.
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The authors are grateful to the Center of Analyses and Characterization (CAC) of the University of Cadi Ayyad, Marrakech, Morocco.
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Ait-karra, A., Zakir, O., Ait baha, A. et al. Electrodeposition and characterization of copper sulfide (CuS) thin film: towards an understanding of the growth mechanism. J Solid State Electrochem 27, 2051–2065 (2023). https://doi.org/10.1007/s10008-023-05471-4
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DOI: https://doi.org/10.1007/s10008-023-05471-4