The purpose of this study focuses to design sliver- based alloy targets. Copper, titanium and zinc were added in the sliver matrix. Sliver ingots were produced by plasma arc melting and shaped by rolling and heat treatment. Direct current (DC) sputtering was used to deposited sliver-alloy thin films on silicon substrates and optical- glass substrates. Microstructures, compositions, performance and optical characteristics with different ratios will be discussed. The structures of sliver-alloy thin films will also be investigated by analyzing components and microstructures. The result reveal that AC0.5、AC1.5 and ACZ are homogenous structures after homogenization. Grain sizes are reduced at the copper ratio from 0.5 % to 1.5 %. Because ACT1 and ACT3 don’t dissolve easily into alloys, titanium can precipitate along the grain boundary. ACT3 is hard to process, so the sputtering speed decreases. Thin films composed of sliver copper and sliver zinc have 30%~40% reflectivity at wavelength of 405 nm; in other words, they are suitable for semi-reflective layers. Sliver-copper-titanium thin films have 20%~30% reflectivity at 405 nm and the reflectivity will be reduced by adding titanium. The ratio of decrease in reflectivity is better than other alloy films. Surface morphology after corrosion experiment can be observed that titanium thin films consist of 1wt% and 3wt% don’t be dissolved by NaCl. Polarization experiment also indicates that the thin films added 1wt% titanium have effect on corrosion.