本研究係利用二階段退火及鋁金屬誘發結晶法生成多晶矽薄膜,並探討此薄膜之光電特性。第一階段退火製程採用鋁誘發結晶法誘發非晶矽薄膜,其目的在於鋁金屬具有降低結晶溫度與縮短製程時間之作用,因此可於短時間內生成多晶矽薄膜。而第二階段退火製程則利用第一階段誘發生成的多晶矽薄膜為晶種,於不同退火溫度及時間下誘發出更厚之多晶矽薄膜,並分析薄膜各項特性,以得到最佳薄膜品質,以供製備薄膜太陽能電池之使用。 實驗結果得知,利用二階段退火製程方法可於450°C退火10分鐘條件之下,成本今o出膜厚2μm的多晶矽薄膜,且薄膜載子移動率可達71.7cm2/V-s。相較於文獻於1000℃下退火1小時所得之多晶矽薄膜,具有製程時間較短及結晶溫度較低之特點。且利用此法所成長之薄膜結晶晶粒具有晶粒橫向寬度大於縱向長度之優點,有助於提昇薄膜載子移動率,並高於固相結晶法所製,且還可克服高溫製程下薄膜殘留應力與結晶晶粒過小之缺點。由於多晶矽薄膜與非晶矽薄膜成份皆屬於矽,因此可減少誘發成長過程會產生的晶格常數不匹配問題,並可降低介面缺陷產生之數量,以達到提高薄膜生長速率及縮短薄膜生長時間之目的。
In this study, we used two step annealing and aluminum metal induced method to produce polysilicon film which can be applied to solar cell, and discuss the electrical characteristic of the thin film. The first step annealing of induced amorphous silicon thin film is induced by aluminum metal induced method. The purpose is to reduce crystallizing temperature and process time, because polysilicon film can be induced in a short time. The first annealing step polysilicon film is used as the seeding layer in the second annealing step to induce the thicker amorphous silicon film under different annealing temperatures and time. We analyze the characteristics of the thin film to find a best quality of it that can be applied to solar cell. The results show that the 2μm thick polysilicon thin film can be can induced by second step annealing method under 450℃ in 10 minutes, and the maximum carrier mobility is up to 71.7cm2/V-s in this study. Comparing to the references that obtain the polysilicon thin film under 1000℃ annealing 1 hour, aluminum metal induced method has the advantages of shorter processing time and lower crystallizing temperature. The lateral direction of the grain of induced polysilicon thin film by this method is larger than the vertical direction of that. This method can enhance the carrier mobility that is higher than SPC method and overcome the defect of the residual stress under high temperature and the small grain size. The composition of most polysilicon and amorphous silicon thin film are silicon, so it can reduce the mismatch of lattice constant produced in process and the numbers of the deficiency to improve the growth rate and decrease the growth time.