In order to investigate the behavior of binder burn-out for developing thin-film electrodes for the electronic devices, various metal pastes were employed and the effects on the binder burn-out were studied. It was found that the precious metal paste showed catalytic activity during the binder bum-out and that the catalytic activity depended on the manufacturing process. In case of the dispersion process with the destruction of the oxidation film, it was found that the catalyst activity was enhanced by the dispersion since the oxidation film was destroyed by the dispersion to form new catalyst active metal surfaces. On the other hand, in case of the dispersion process without the destruction of the oxidation film, the catalyst activity remained the same by the dispersion.