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Vol. 16, Issue 2, 2019
April 01, 2019 EDT
Recent Advances and Trends in Heterogeneous Integrations
John H. Lau
,
Heterogeneous integrations
system-in-package
substrates
multichip module
through-silicon via
fan-out wafer-level packaging
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https://doi.org/10.4071/imaps.780287
Journal of Microelectronics & Elect Pkg
Lau, John H. 2019. “Recent Advances and Trends in Heterogeneous Integrations.”
Journal of Microelectronics and Electronic Packaging
16 (2): 45–77.
https://doi.org/10.4071/imaps.780287
.
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