[1]
P. Godignon, V. Soler, M. Cabello, J. Montserrat, J. Rebollo, L. Knoll, E. Bianda, A. Mihaila, New Trends in High Voltage MOSFET Based on Wide bandgap materials,, Int. Semicond. Conf., Oct (2017).
DOI: 10.1109/smicnd.2017.8101143
Google Scholar
[2]
X. Huang, L. Fursin, A. Bhalla, W. Simon, J. Chris Dries, Design and Fabrication of 3.3kV SiC MOSFETs for Industrial Applications,, Int. Symp. on Power Semiconductor Devices and ICs, May (2017).
DOI: 10.23919/ispsd.2017.7988908
Google Scholar
[3]
W. Sung, B. J. Baliga, On developing one-chip integration of 1.2kV SiC MOSFET and JBS diode (JBSFET),, IEEE Trans. on Industrial Electronics, 64-10, Oct 2017, pp.8206-8212.
DOI: 10.1109/tie.2017.2696515
Google Scholar
[4]
B. J. Baliga, K. Han, J. Harmon, A. Tucker, S. Syed, W. Sung, PRESiCE: Process Engineered for manufacturing SiC Electronic Devices,, Int. Conf. Silicon Carbide and Related Materials, Sept (2017).
DOI: 10.4028/www.scientific.net/msf.924.523
Google Scholar
[5]
Information on https://www.wolfspeed.com/c2m0160120d.
Google Scholar
[6]
B. J. Baliga, Fundamentals of power semiconductor devices,, Springer Science and Business Media, New York, NY, USA, (2008).
Google Scholar
[7]
Y. Nakao, S. Watanabe, N. Miura, M. Imaizumi, T. Oomori, Investigation into Short-Circuit Ruggedness of 1.2kV 4H-SiC MOSFETs,, Int. Conf. Silicon Carbide and Related Materials, Sept (2017).
DOI: 10.4028/www.scientific.net/msf.600-603.1123
Google Scholar
[8]
H. Hatta, T. Tominaga, S. Hino, N. Miura, S. Tomohisa, S. Yamakawa, Suppression of short-circuit current with embedded source resistance in SiC-MOSFET,, Int. Conf. Silicon Carbide and Related Materials, Sept (2017).
DOI: 10.4028/www.scientific.net/msf.924.727
Google Scholar
[9]
S. Bontemps, A. Basler, P. Doumerge, Evaluation of the need for SiC SBD in parallel with SiC MOSFETs in a module phase leg configuration,, Int. Conf. Power Electronics, Intelligent Motion, Ren. Energy and Energy Management, May (2015).
Google Scholar
[10]
Information on https://www.wolfspeed.com/power.products/bare-die-4/cpw4-1200-s005b.
Google Scholar