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HomeMaterials Science ForumMaterials Science Forum Vol. 729Development of Thermally Conductive Polymer...

Development of Thermally Conductive Polymer Materials and their Investigation

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Abstract:

In the recent years a remarkable development can be observed in the electronics. New products of electronic industry generate more and more heat. To dissipate this heat, thermally conductive polymers offer new possibilities. The goal of this work was to develop a novel polymer based material, which has a good thermal conduction. The main purpose during the development was that this material can be processed easily with injection molding. To eliminate the weaknesses of the traditional conductive composites low-melting-point alloy was applied as filler. Furthermore in this work the effect of the filler content on thermal conductivity, on structure and on mechanical properties was investigated.

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Materials Science, Testing and Informatics VI

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Periodical:

Materials Science Forum (Volume 729)

Pages:

80-84

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.729.80

Citation:

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Online since:

November 2012

Authors:

András Suplicz, József Gábor Kovács

Keywords:

Hot-Plate Method, Injection Molding, Low Melting Point Alloy, Thermal Conductivity (TC)

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