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HomeKey Engineering MaterialsKey Engineering Materials Vols. 259-260Simulation of the System Silicon Substrate-Thin...

Simulation of the System Silicon Substrate-Thin CBN Film

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Advances in Grinding and Abrasive Processes

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Periodical:

Key Engineering Materials (Volumes 259-260)

Pages:

101-105

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.259-260.101

Citation:

Cite this paper

Online since:

March 2004

Authors:

Feng Xie, W.L. Shen, A. Lunk

Keywords:

CBN Film, Finite Element Model (FEM), Thermal Stress

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