Fe and Cu Removal Efficiency in HF-DIW/O3 Cleaning Sequence
p.109
p.109
Post Polysilicon Etch (Incorporating DUV Resist an BARC) Polymer Cleaning
p.113
p.113
Determination of Moisture / Water in Semiconductor Processing Liquids On-Line with the SemiChem Process Analyzer
p.117
p.117
Evaluation of Cleaning Recipes Based on Ozonated Water for Pre-Gate Oxide Cleaning
p.119
p.119
Characterization of Emitter Interface Oxide Growth in a Vertical LPCVD Polysilicon Deposition Reactor
p.123
p.123
Nitride Strip: Phosphoric Acid Bath-Life above 100 Hours
p.127
p.127
Wet Metal Etching for Ti/Co Self-Aligned Silicides
p.131
p.131
Post-Titanium-Salicide Cleaning with Spray Technology
p.135
p.135
XPS Study of the Cleaning Efficiency by Ozone Processes of the Protective Films Formed by Reactive Ion Etching of Co and Ti Silicide
p.139
p.139
Characterization of Emitter Interface Oxide Growth in a Vertical LPCVD Polysilicon Deposition Reactor
Abstract:
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Info:
Periodical:
Solid State Phenomena (Volumes 65-66)
Pages:
123-126
Citation:
Online since:
November 1998
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