Effects of Substrate Temperature on the Leaning of Micropatterns during Rinse-Dry Process

Tae Hong Kim; Jung Chul Kim; Seung Ho Kim; Ho Young Kim

doi:10.4028/www.scientific.net/SSP.195.247

Paper Titles

Influence of Ammonia Gas Ambient in IPA Drying Process of the Single Wafer Cleaning System
p.231

Wetting Challenges in Cleaning of High Aspect Ratio Nano-Structures
p.235

Evaluation of High-Speed Linear Air-Knife Based Wafer Dryer
p.239

Improved Drying Technology of Single Wafer Tool by Using Hot IPA/DIW
p.243

Effects of Substrate Temperature on the Leaning of Micropatterns during Rinse-Dry Process
p.247

Advanced Vacuum Wafer Drying for Thermal Laser Separation Dicing Assessment Results from European Collaborative “SEAL” Project
p.252

Diffusion Behavior of Transition Metals Penetrating Silicon Substrate through Silicon Dioxides by Dopant Ion Implantation
p.261

Evaluation of Hafnium Contamination on Wafer Surfaces after the Wet Cleaning Process
p.265

Real-Time Analyses of Metal Contaminations in the ppb-Range
p.269

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Effects of Substrate Temperature on the Leaning of Micropatterns during Rinse-Dry Process

Abstract:

The spin drying, in which a rinsing liquid deposited on a wafer is rapidly dried by wafer spinning, is an essential step in semiconductor manufacturing process. While the liquid evaporates, its meniscus straddles neighboring submicron-size patterns. Then the capillary effects that pull the patterns together may lead to direct contact of the patterns, which is referred to as pattern leaning, a problem becoming more and more serious as the pattern size shrinks and the aspect ratio of the patterns increases. The interaction between elastic structures and capillary forces, or elasto-capillarity [1, 2], has long been observed in nature but just starts to find its applications in artificial system. It is particularly relevant to the fabrication of high-aspect-ratio structures in semiconductor manufacturing [3, 4, 5] because it is responsible for the stiction of patterns in rinsing and drying process. Here we visualize the micropattern leaning process and evaluate the role of substrate temperature in preventing collapse of patterns.