The Thermal Annealing Effect on the Residual Stress and Mechanical Property in the Compressive Stressed DLC Film
p.3619
p.3619
Low Stress Tetrahedral Amorphous Carbon Films Prepared by Filtered Vacuum Arc Deposition
p.3623
p.3623
Influence of Film Thickness on Intrinsic Growth Stress and Raman Evaluation of Tetrahedral Amorphous Carbon Films
p.3627
p.3627
Microstructures and Properties of the DLC Films Prepared by PLD Process Using High Power High Frequency 308 nm Laser Beam
p.3631
p.3631
Improvement of Adhesion of Cubic Boron Nitride Films: Effect of Interlayer and Deposition Parameters
p.3635
p.3635
Evolution of Stress-Induced Surface Damage and Stress-Relaxation of Electroplated Cu Films at Elevated Temperatures
p.3641
p.3641
Microscopic Investigation of Strain Localization and Fatigue Damage in Thin Cu Films
p.3647
p.3647
Phase Separation into Nano-Crystalline Nitrides in Ternary Ti-Si-N System via N Implantation
p.3651
p.3651
TiC/a-C Nanocomposite Coatings for Low Friction and Wear Resistance
p.3655
p.3655
Improvement of Adhesion of Cubic Boron Nitride Films: Effect of Interlayer and Deposition Parameters
Abstract:
Diamond and B4C coatings were used as an interlayer for the growth of cubic boron nitride thin films on c-silicon. By employing a B-C-N gradient layer on top of the B4C interlayer, improved adhesion occured between BN and B4C. A multi-step process after the nucleation of c-BN was found very helpful for improving the adhesion of c-BN on silicon with interlayers. Residual stress of c-BN thin film was significantly decreased by using a new post-deposition annealing treatment.
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Periodical:
Materials Science Forum (Volumes 475-479)
Pages:
3635-3640
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Online since:
January 2005
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