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HomeMaterials Science ForumMaterials Science Forum Vols. 207-209Prediction of the BCC Structure in a Cu ∑3-84°...

Prediction of the BCC Structure in a Cu ∑3-84° <211> Tilt Grain Boundary and its Confirmation by HRTEM

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Intergranular and Interphase Boundaries in Materials II

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Periodical:

Materials Science Forum (Volumes 207-209)

Pages:

337-340

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.207-209.337

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Online since:

February 1996

Authors:

C. Schmidt, Mike W. Finnis, V. Vitek, F. Ernst

Keywords:

Atomistic Computer Simulation, BCC Structure in Cu, Cu ∑3 Tilt Grain Boundary

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