A Dual Boundary Element Model for Electromechanical Impedance Based Damage Detection Applications

F. Zou; M.H. Aliabadi

doi:10.4028/www.scientific.net/KEM.665.265

Paper Titles

Uncertainty Analysis of Active SHM System
p.249

Fracture Events Localization by Numerical Simulations of Cementitious Composites
p.253

On the Validation of Williams' Stress Function for Dynamic Fracture Mechanics
p.257

Energy Dissipation during Quasi-Brittle Fracture Associated with the Crack and the Fracture Process Zone Progression
p.261

A Dual Boundary Element Model for Electromechanical Impedance Based Damage Detection Applications
p.265

Optimal Sensor Placement for Damage Detection Based on Ultrasonic Guided Wave
p.269

Application of the Nonlinear Model of a Beam for Investigation of Interlaminar Fracture Toughness of Layered Composite
p.273

Numerical Investigation of a Stiffened Panel Subjected to Low Velocity Impacts
p.277

Finite Element Analysis on Crack Tip Deformation Behavior under Mode-II Loading in Single Crystal Superalloy
p.281

HomeKey Engineering MaterialsKey Engineering Materials Vol. 665A Dual Boundary Element Model for...

A Dual Boundary Element Model for Electromechanical Impedance Based Damage Detection Applications

Abstract:

In this paper, a boundary element method (BEM) for the time-harmonic analysis of electromechanically (EM) coupled 3D structures is presented. Among the two components of an EM coupled structure, the piezoelectric transducer is modelled by a semi-analytical finite element method (FEM), and the host structure is formulated by the dual boundary element method (DBEM). The analysis of the coupled structure is performed in the Fourier domain. The electromechanical impedance (EMI) of the system is used for the purpose of detecting damages.

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Periodical:

Key Engineering Materials (Volume 665)

Pages:

265-268

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.665.265

Citation:

Cite this paper

Online since:

September 2015

Authors:

F. Zou, M.H. Aliabadi

Keywords:

Dual Boundary Element Method, Electromechanical Impedance, Piezoelectric Transducer, Structural Health Monitoring

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