Joining with Electrochemical Support: Cold Pressure Welding of Copper – Weld Formation and Characterization

Hans Christian Schmidt; Dmytro Rodman; Olexandr Grydin; Christoph Ebbert; Werner Homberg; Hans Jürgen Maier; Guido Grundmeier

doi:10.4028/www.scientific.net/AMR.966-967.453

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 966-967Joining with Electrochemical Support: Cold...

Joining with Electrochemical Support: Cold Pressure Welding of Copper – Weld Formation and Characterization

Abstract:

Cold pressure welding is a versatile process that can be used to weld most metals. It is, however, difficult to achieve a weld at room temperature through the application of pressure. As in every welding process, several different parameters have to be considered: the metals to be welded and their properties in terms of surface condition, cleanliness, strength of the metal, and so on. The surface condition and surface preparation methods are the most important parameters, since the cold weld is based solely on the contact between the two metal surfaces that are involved. Joining with electrochemical support (ECUF) is a new approach that overcomes most of the current process barriers and limitations through optimized electrochemical surface treatment and an improved process technology based on a pilger roll. This paper provides an overview of the ECUF process and current research results on the pressure welding of pure copper (CW004A). The formation of the weld has been investigated and the welding interface characterized in respect of its microstructure.

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Periodical:

Advanced Materials Research (Volumes 966-967)

Pages:

453-460

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.966-967.453

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Online since:

June 2014

Authors:

Hans Christian Schmidt*, Dmytro Rodman, Olexandr Grydin, Christoph Ebbert, Werner Homberg, Hans Jürgen Maier, Guido Grundmeier

Keywords:

Cold Pressure Welding, Copper, Cyclic Voltammetry, Surface Activation

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* - Corresponding Author

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