Effect of Sb Addition on Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Ball Joints

Marina Oyama; Tatsuya Kobayashi; Ikuo Shohji; Mohd Arif Anuar Mohd Salleh

doi:10.4028/p-AxJR0d

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 967Effect of Sb Addition on Microstructure and Shear...

Effect of Sb Addition on Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Ball Joints

Abstract:

The effect of a small amount of Sb addition to Sn-3.0Ag-0.5Cu (mass%) solder on microstructures and impact properties of the solder ball joint was investigated. Cross-sectional microstructural observation revealed that scalloped Cu₆Sn₅ is formed at the solder/Cu interface, and Cu₃Sn is formed at the interface between Cu₆Sn₅ and Cu with aging. It was confirmed that the growth of the reaction layer is suppressed by the addition of Sb. Moreover, the result of the impact ball shear test showed that the decrease in impact properties with aging can be suppressed in Sn-3.0Ag-0.5Cu-1.5Sb (mass%). It was also suggested that the suppression of linear crack propagation at the Cu₃Sn/Cu₆Sn₅ interface is effective to prevent the reduction of absorbed energy.

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Periodical:

Key Engineering Materials (Volume 967)

Pages:

43-49

DOI:

https://doi.org/10.4028/p-AxJR0d

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Online since:

December 2023

Authors:

Marina Oyama*, Tatsuya Kobayashi, Ikuo Shohji, Mohd Arif Anuar Mohd Salleh

Keywords:

Additive Elements, Ball Shear Impact Strength, Fracture Mode, Sn-3.0Ag-0.5Cu, Solder Ball Joint

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* - Corresponding Author

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