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Silicon Carbide and Related Materials 2003
Subtitle:
ICSCRM 2003
Description:
Because of their many superior properties, including a wide band-gap and high breakdown field, which are different to those of conventional semiconductors such as Si and GaAs, compounds such as SiC, III-Nitrides and related materials are currently attracting increasing attention and are being targeted as possible solutions in a variety of problematic fields of electronic application: including high temperature, high power, radiation-resistant and microwave use.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
Volume is indexed by Thomson Reuters CPCI-S (WoS).
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Info:
eBook:
ToC:
Editors:
Roland Madar, Jean Camassel and Elisabeth Blanquet
BIC:
TGM
BISAC:
TEC021000
Keywords:
3C-SiC, 4H-SiC, 6H-SiC, Breakdown Voltage, Chemical Vapor Deposition (CVD), Defect, Dislocation, DLTS, Edge Termination, Gallium Nitride (GaN), Interface States (or Traps), Ion Implantation, Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET), Micropipe, Oxidation, Photoluminescence (PL), PiN Diode, Silicon Carbide (SiC), Stacking Fault, TEM
Details:
Proceedings of the 10th International Conference on Silicon Carbide and Related Materials 2003, Lyon, France, October 5-10, 2003
Pages:
1548
Year:
2004
ISBN-13:
9780878499434
ISBN-13 (CD):
9783038599456
ISBN-13 (eBook):
9783035706291
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