A New Retention Method for Sub-10 nm Liquid Filtration Using Fluorescent CdSe QDs
p.217
p.217
Investigation of the Evaporation and Wetting Mechanism of IPA-DIW Mixtures
p.223
p.223
Effect of the Surface/Water Chemistry on the Creation of Watermarks
p.227
p.227
Influence of Ammonia Gas Ambient in IPA Drying Process of the Single Wafer Cleaning System
p.231
p.231
Wetting Challenges in Cleaning of High Aspect Ratio Nano-Structures
p.235
p.235
Evaluation of High-Speed Linear Air-Knife Based Wafer Dryer
p.239
p.239
Improved Drying Technology of Single Wafer Tool by Using Hot IPA/DIW
p.243
p.243
Effects of Substrate Temperature on the Leaning of Micropatterns during Rinse-Dry Process
p.247
p.247
Advanced Vacuum Wafer Drying for Thermal Laser Separation Dicing Assessment Results from European Collaborative “SEAL” Project
p.252
p.252
Wetting Challenges in Cleaning of High Aspect Ratio Nano-Structures
Abstract:
In semiconductor fabrication, pattern collapse of high aspect ratio structures after wet processing has been a critical issue and attracted a lot of interest. On the other hand, very little attention is spent on the potential wetting issues as feature dimensions are continuously scaled down and novel materials with different wetting properties are used in new technology nodes. In this work we investigate the wettability of nanopatterned silicon substrates with different surface modifications.
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Info:
Periodical:
Solid State Phenomena (Volume 195)
Pages:
235-238
Citation:
Online since:
December 2012
Keywords:
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