Pulsed Electric Current Bonding of Tungsten to Titanium

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Abstract:

Pulsed electric-current sintering was applied to the bonding of tungsten to titanium. The influence of bonding condition on the bond strength of joint was investigated by observing the microstructure. The bonding process was carried out at bonding temperature from 773 to 1273 K for 1.8 ks at a bonding pressure of 40 MPa. The bond strength of the joint bonded at the temperature higher than 1173 K was around 200 MPa. This joint fractured in the tungsten during tensile test. SEM-EDX observation revealed that W diffused into Ti at the joint interface of the joint bonded at the temperature higher than 973 K.

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445-448

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April 2014

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