A Vacuum Sucking Approach to Preventing Chips from Attaching to Machined Surface in Cutting of KDP Crystals

Zi Wen Zheng; Hao Feng Chen; Yi Fan Dai; Hang Gao; Gui Lin Wang; Xiao Ping Li

doi:10.4028/www.scientific.net/KEM.443.573

Paper Titles

A New Solution Method for Homogenization of Effective Properties of Electromagnetic Honeycombs
p.551

Surface Roughness and Stress Responses of a Feldspar Porcelain to Fatigue Impact
p.557

FEA-Predicted Subsurface Damage in Micro Finishing of a Feldspar Porcelain Using Fine-Grit Dental Burs
p.562

Production, Characterization and Application of Silicon-on-Sapphire Wafers
p.567

A Vacuum Sucking Approach to Preventing Chips from Attaching to Machined Surface in Cutting of KDP Crystals
p.573

Critical Undeformed Chip Thickness and Cutting Pressure in Relation to Ductile Mode Cutting of KDP Crystal
p.582

Influence of the Workpiece Crystallographic Orientation on Ultra-Precision Turning of KDP Crystals
p.588

Some Aspects of Improving Integrity of Machined Surfaces on Al/SiCp Metal Matrix Composites
p.596

Cutting Characteristic of Polycarbonate Sheet Subjected to Wedge Indentation by Knife Edge and Grooved Plate
p.602

HomeKey Engineering MaterialsKey Engineering Materials Vol. 443A Vacuum Sucking Approach to Preventing Chips from...

A Vacuum Sucking Approach to Preventing Chips from Attaching to Machined Surface in Cutting of KDP Crystals

Abstract:

Potassium Dihydrogen Phosphate (KDP) crystals are used for the key components in high power density solid-state laser for Inertial Confinement Fusion. KDP crystals are mainly machined in the dry cutting condition to avoid ‘Fogging’ of the crystals. The main difficulty identified in dry machining of KDP is chip removal from the machined surface. A vacuum sucking device based on venturi vacuum pump is used to suck the chips during cutting, and the relationship between level of vacuum in cutting zone and the comply air pressure was established. An empirical model for chip emission during turning processes is used to analyze the influence of cutting parameters on the chip emission. The influence of cutting parameters on the removal of chips is investigated. Finally, a face turning of KDP crystals is carried out with the turning parameters of feed rate 1um/rev, depth of cut of 0.8 um/rev and the cutting speed from 1.82m/s to 3.9m/s. A super-smooth surface with chips free in the whole sample is achieved, having the surface roughness of 2.994nm (Ra) measured by AFM. The surface quality achieved satisfies the requirements of KDP crystals implemented in high power lasers.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Key Engineering Materials (Volume 443)

Pages:

573-581

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.443.573

Citation:

Cite this paper

Online since:

June 2010

Authors:

Zi Wen Zheng, Hao Feng Chen, Yi Fan Dai, Hang Gao, Gui Lin Wang, Xiao Ping Li

Keywords:

Ductile Mode Cutting, KDP Crystal, Preventing Chip, Vacuum Sucking

Export:

RIS, BibTeX

Price:

Permissions:

Request Permissions

References

[1] WANG Jing-he, Chen Mingjun, Dong Shen, and Zhang Longjiang: Opto-Electronic Engineering, Vol. 32 (2005), pp.14-17.

Google Scholar

[2] Ma Encai: Research on Mechanical Properties of KDP Crystal in Ultra-precision Machined Surface (Harbin Institute of Technology Publications, China 2006).

Google Scholar

[3] Wang Hongxiang, Gao Shi, Ma Encai, Xu Qiao, Chen Xianhua, and Hou Jing: Material science & Technology, Vol. 115 (2007), pp.62-69.

Google Scholar

[4] Chen M.J., Wang J.H., Liang Y.C., and Yuan D. Y: Key Engineering Materials, Vol. 339 (2007), pp.1-5.

Google Scholar

[5] Chen M.J., Wang J.H., Chen X.M., and Liang Y.C.: Key Engineering Material, Vol. 329 (2007), pp.427-432.

Google Scholar

[6] Baruch A, Fuchs P.: Applied Optics, 1986, 25 (11): 1733-1735.

Google Scholar

[7] Richard C. Montesanti, and Samuel L. Thompson: A procedure for diamond turning KDP crystals (Lawrence Livermore National Laboratory Publication, USA 1995).

DOI: 10.2172/105024

Google Scholar

[8] Rajanish Javvaji: �anoscale ductile mode ultra-precision cutting of potassium dihydrogen phosphate (National university of Singapore Publication, Singapore 2008).

Google Scholar

[9] G. Kumar, and S. Beaudion: Journal of the Electrochemical Society, Vol. 153 (2006), pp.175-181.

Google Scholar

[10] R. Khettabi, V. Songmene, and J. Masounave: Journal of Materials Processing Technology, Vol. 194 (2007), pp.100-109.

Google Scholar