Curing Process of Epoxy Resin Using Low Molecular Polyamide 651 as Curing Agent

Chun Hua Han; Lin Wang; Dong Yu Zhao

doi:10.4028/www.scientific.net/AMR.936.63

Paper Titles

Preparation and Properties of Polypropylene-Graft-Cardanol by Reactive Extrusion
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Analysis and Experiment of Compressive Residual Strength of Composite Laminates with Holes
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Microstructures of Poly (9'9-Dihexylfluorene) Grown in the Non-Solvent Vapor
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Synthesis and Properties of Polypropylene Carbonate Polyol-Based Waterborne Polyurethane
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Curing Process of Epoxy Resin Using Low Molecular Polyamide 651 as Curing Agent
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Synthesis of Bis(p-aminophenoxy)Dimethylsilane(p-APDS) and its Process Optimization
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Structure and Mechanical Properties of Starch/Styrene-Butadiene Latex Composites
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Experimental Advances in Effect of Waviness on Properties of Fibre Reinforced Composite Materials
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 936Curing Process of Epoxy Resin Using Low Molecular...

Curing Process of Epoxy Resin Using Low Molecular Polyamide 651 as Curing Agent

Abstract:

In this paper low molecular polyamide 651(PA651) is used as the curing agent of epoxy resin. The optimum curing conditions and dosage of the curing agent are obtained by DMA and FT-IR analysis. Based on the dynamic mechanical temperature spectra of samples test, the best curing conditions are room temperature 2 hours, 70°C 2 hours, 125°C 2.5 hours and 150°C 1 hours (RT / 2 h + 70 °C / 2 h +125°C / 2.5 h + 150 °C / 1 h). The best dosage of curing agent PA651 is 50 wt %. Since the analysis of Fourier Infrared spectral verified that epoxy groups react completely, the curing conditions are the best curing process.

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Periodical:

Advanced Materials Research (Volume 936)

Pages:

63-66

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.936.63

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Online since:

June 2014

Authors:

Chun Hua Han, Lin Wang, Dong Yu Zhao*

Keywords:

Curing Agent Content, Curing Time, Dynamic Mechanical Behavior, Epoxy Resin (ER), Low Molecular Polyamide 651 (PA651)

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* - Corresponding Author

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