Development of High-Efficiency and Crack-Free Grinding Process for Chamfering of LCD Glass Edge

Y.B. Tian; H. Xu

doi:10.4028/www.scientific.net/AMR.797.240

Paper Titles

Experimental Study on Fractal Laws of Cutting Force for Machining Irregular Surface of Granite
p.214

Experimental Investigations of Grinding Forces in Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire
p.223

Study on Numerical Simulation and Experimental of Cutting Force in Turning Machinable Glasses Ceramics
p.229

Grinding Force and Surface Roughness in Ultrasonic Assisted Grinding of SiC Ceramics with Diamond Grinding Wheel
p.234

Development of High-Efficiency and Crack-Free Grinding Process for Chamfering of LCD Glass Edge
p.240

Predicted Model of Cutting Force for Single Diamond Fast Milling Hard-Brittle Materials
p.246

Study on Thermal Influence of Grinding Process on LiTaO₃
p.252

Study on Chemical Mechanical Polishing Parameters of 6H-SiC Crystal Substrate Based on Diamond Abrasive
p.261

Optimization of Process Parameters Based on Multi-Process and Multi-Evaluation Index for Function Ceramics in CMP
p.266

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 797Development of High-Efficiency and Crack-Free...

Development of High-Efficiency and Crack-Free Grinding Process for Chamfering of LCD Glass Edge

Abstract:

Glass panels are one of core components in liquid crystal displays (LCDs). Grinding is an essential edge chamfering process in the preparation of LCD glass panel. With the size of glass panel increasing, both high productivity and high quality are required in the edge chamfering process. However, surface and subsurface defects are usually introduced to the chamfered glass edge under high-efficiency grinding conditions. In this work, we explored to develop crack-free grinding process while maintaining high chamfering efficiency with two designed diamond wheels for the chamfering of LCD glass edges. The grinding performance was compared and analyzed in terms of surface roughness and morphology. Normal and tangential grinding forces were measured to characterize the material removal characteristics. It was found that crack-free grinding/chamfering of LCD glass edge was achieved under high-efficiency grinding conditions i.e. wheel speed of 52.3 m/s, feed rate of 10 m/min, depth of cut of 50 μm. The developed grinding process is potential to reduce subsequent polishing time and cost or even replace subsequent polishing process for the preparation of LCD glass edge.