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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 421Non-Metal Reinforced Lead-Free Composite Solder...

Non-Metal Reinforced Lead-Free Composite Solder Fabrication Methods and its Reinforcing Effects to the Suppression of Intermetallic Formation: Short Review

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Abstract:

To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders.This paper reviews the fabrication processes of the lead-free composite solder and its non-metal reinforcing effects to the suppression of intermetallic formation. Most researchers using different solder fabrication methods have found that byadditions of non-metal reinforcement from micron up to nanoparticle size had suppressed the intermetallic compound formations of lead-free composite solders.

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Information Technology for Manufacturing Systems IV

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Periodical:

Applied Mechanics and Materials (Volume 421)

Pages:

260-266

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.421.260

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Cite this paper

Online since:

September 2013

Authors:

Mohd Arif Anuar Mohd Salleh, Kazuhiro Nogita, Stuart Mcdonald

Keywords:

Intermetallic, Lead-Free Solder, Mechanical Mixing, Powder metallurgy

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