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3D 3C Walkaway to Calibrate Surface Seismic
- Publisher: European Association of Geoscientists & Engineers
- Source: Conference Proceedings, 3rd EAGE Workshop on Borehole Geophysics, Apr 2015, cp-447-00040
- ISBN: 978-94-6282-144-6
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Abstract
Improved processing tools enable a new approach of complex land 3D VSP analysis. The first aim is to extract information useful for processing and interpretation of 3D surface data, the second one to obtain elastic wave fields (PP, P-SV, SV-SV, SH-SH) ready for imaging, from VSP data in 3 Components.