Abstract
New high-speed photonic technologies and co-integration with electronics are required to keep up with the demand of future optical communication systems. In this paper, plasmonics is presented as one of the most promising next-generation photonic technologies that already fulfils these requirements in proof-of-concept demonstrations. Plasmonics features not only modulators and detectors of highest speed, but also compactness, cost- and energy-efficiency, and compatibility with CMOS electronics. Recently, co-integration with electronics was demonstrated with record performances of 222 GBd in a hybrid InP electronic-plasmonic transmitter assembly and of 120 GBd with a monolithic BiCMOS electronic-plasmonic transmitter. Show more
Permanent link
https://doi.org/10.3929/ethz-b-000485515Publication status
publishedExternal links
Journal / series
Japanese Journal of Applied PhysicsVolume
Pages / Article No.
Publisher
IOP PublishingOrganisational unit
03974 - Leuthold, Juerg / Leuthold, Juerg
02635 - Institut für Elektromagnetische Felder / Electromagnetic Fields Laboratory
Funding
688166 - A generic CMOS-compatible platform for co-integrated plasmonics/photonics/electronics PICs towards volume manufacturing of low energy, small size and high performance photonic devices (SBFI)
Related publications and datasets
Is new version of: http://hdl.handle.net/20.500.11850/456210
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