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霉菌对裸铜和镀金处理的印制电路板腐蚀行为的影响 |
邹士文1,李晓刚1,2,董超芳1,2,李慧艳1,肖葵1,2 |
1. 北京科技大学腐蚀与防护中心, 北京 100083
2. 北京科技大学腐蚀与防护教育部重点实验室, 北京 100083 |
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EFFECT OF MOLD ON CORROSION BEHAVIOR OF PRINTED CIRCUIT BOARD-COPPER AND ENIG FINISHED |
ZOU Shiwen1, LI Xiaogang1,2, DONG Chaofang1,2,LI Huiyan1, XIAO Kui1,2 |
1. Corrosion and Protection Center, University of Science and Technology Beijing, Beijing 100083
2. Key Laboratory of Corrosion and Protection, Ministry of Education, University of Science and Technology Beijing,Beijing 100083 |
引用本文:
邹士文,李晓刚,董超芳,李慧艳,肖葵. 霉菌对裸铜和镀金处理的印制电路板腐蚀行为的影响[J]. 金属学报, 2012, 48(6): 687-695.
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EFFECT OF MOLD ON CORROSION BEHAVIOR OF PRINTED CIRCUIT BOARD-COPPER AND ENIG FINISHED[J]. Acta Metall Sin, 2012, 48(6): 687-695.
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