Abstract
Multicrystalline silicon surface texturing using the mixed etching solution of the sodium hydroxide (NaOH) and of the sodium hypochlorite (NaClO) has been investigated. The reaction rate during the texturing process is easier to control due to the presence of NaOCl as an oxidizing agent in NaOH solution. The advantage of this etching is that the uniform mc-Si surface texturing with a low step height and less grain boundary delineation can be obtained. The Mc-Si surface after NaOH-NaOCl mixed etching with the 1: 4 ratio in the case of 20% NaOH has the optimum light trapping effect. In the case of the optimum etching condition, the average reflectivity for the textured surface of a large area (156 × 156 mm2) mc-Si can be reduced to less than 10%.
Similar content being viewed by others
References
Gangopadhyay, U., Dhungel, S.K., Kim, K., Manna, U., Basu, P.K., Kim, H.J., Karungaran, B., Leo, K.S., Yow, J.S., and Yi, J., Novel low cost chemical texturing for very large area industrial multi-crystalline silicon solar cells, Semicondr. Sci. Tech., 2005, vol. 20, no. 9, pp. 938–946.
Macdonald, D.H., Cuevas, A., Kerr, M.J., Samundsett, C., Ruby, D., Winderbaum, S., and Leo, A., Texturing industrial multicrystalline silicon solar cells, Sol. Energy, 2004, vol. 76, nos. 1–3, pp. 277–283.
Geetha, M., Kumar, P.S., Govindan, R., Ramu, P., Arivuselvam, L., and Anbarasan, P.M., Design of microlens focused V-groove textured silicon solar cell with different aspect ratio using ZEMAX, Recent Research in Science and Technology, 2010, vol. 2, no. 10, pp. 5–8.
Vazsonyi, E., Clercq, K.D., Einhaus, R., Kerschaver, E.V., Said, K., Poortmans, J., Szlufcik, J., and Nijs, J., Improved anisotropic etching pocess for industrial texturing of silicon solar cells, Sol. Energ. Mat. Sol. C, 1999, vol. 57, no. 2, pp. 179–188.
Hua, X.S., Zhang, Y.J., and Wang, H.W., The effect of texture unit shape on silicon surface on the absorption properties, Sol. Energ. Mat. Sol. C, 2010, vol. 94, no. 2, pp. 258–262.
Manshanden, P., Burgers, A.R., Nositschka, W.A., Voige, O., and Weeber, A.W., Silicon solar cells textured by low damage RIE with natural lithography, Proceedings of the 29th IEEE Photovoltaic Specialists Conference (New Orleans), 2002, pp. 324–327.
Kendall, D.L., Vertical etching of silicon at very high aspect ratios, Annual Review of Materials Research, 1979, vol. 9, pp. 373–403.
Park, S.W., Kim, J., Lee, S.H., Application of acid texturing to multi-crystalline silicon wafers, Journal of the Korean Physical Society, 2003, vol. 43, no. 3, pp. 423–426.
Tyagi, R.K., Theoretical analysis of silicon surface roughness induced by plasma etching, Surf. Eng. Appl. Electrochem., 2013, vol. 49, no. 1, pp. 78–82.
Author information
Authors and Affiliations
Corresponding author
Additional information
The article is published in the original.
About this article
Cite this article
Dong, J., Huang, SH. Low-reflective surface texturing for large area multicrystalline silicon using NaOH-NaClO solution. Surf. Engin. Appl.Electrochem. 50, 28–32 (2014). https://doi.org/10.3103/S1068375514010050
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.3103/S1068375514010050