材料
Online ISSN : 1880-7488
Print ISSN : 0514-5163
ISSN-L : 0514-5163
不活性冷媒中でのポリイミドの劣化挙動
南谷 林太郎初田 俊雄高橋 研二笠井 憲一
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2000 年 49 巻 2 号 p. 204-208

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Perfluorocarbon liquid coolant Fluorinert® FC-72 for electronic devices has a high thermal stability and a low chèmical reactivity. However, FC-72 has been shown to liquate some organic materials. Polyimide has been used extensively in electronic devices as an insulator and as a protective coating. In the present study, the degradation behavior of polyimide in FC-72 was investigated by measuring chemical and mechanical properties. It was found that polyimide had no change of chemical properties, such as dissolution of the constituent and swelling degree, and mechanical properties, such as tensile strength and peel strength in dry FC-72. At temperatures below 150°C, the tensile strength of the polyimide did not degrade by thermal oxidation. The swelling ratio and peel strength degraded as the saturation ratio of dissolved water increased. At temperatures above room temperature, the saturation ratio of dissolved water in FC-72 decreased because of the increasing solubility of water. The absorbed water in polyimide decreased because of the decreasing saturation ratio of dissolved water in FC-72. In this case, the water didn't have much influence on the polyimide degradation.

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