This study introduces research trends in the electronics materials, such as joining materials including high-temperature lead-free solder, sintered materials using metal particles and transient liquid phase (TLP) materials, and conductive materials such as aluminum and copper alloys. These studies include the content of the special issue published in Materials Transactions (Vol. 57, No. 6 and Vol. 60, No. 6) entitled Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing for Such Materials. It also introduces interesting research contents, leading the development of next-generation electronics.