Effects of certain solute elements on the recrystallization temperature of copper have been studied by X-ray, micro-hardness and electrical resistivity measurements. Specimens of copper alloys containing solute elements of 0.01–0.3 at% were melted and cast in vacuo, and cold rolled to 90% reduction. The recrystallization temperatures (the half softening temperatures) of these alloys were obtained from micro-hardness measurements after annealing for 7.2 ks at various temperatures.
All solute elements raised the recrystallization temperature of copper with increase in their contents. The most pronounced influence on the recrystallization temperature was found to be associated with addition of elements which have the much larger linear size factor and the smaller maximum solid solubility. When the electrical resistivity change with cold rolling, Δρ_W, was divided into the two parts of the decrement of resistivity during the recovery process. Δρ_E, and the decrement during the recrystallization process, Δρ_R, strong correlation between the recrystallization temperature and Δρ_E⁄Δρ_W was indicated. From these experimental results, the magnitude of the increase in the recrystallization temperature seems to be related to the binding energy of solute atoms with vacancy and dislocation.