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'Journal of Accelerator Conferences Website' (JACoW) is a publisher in Geneva, Switzerland that publishes the proceedings of accelerator conferences held around the world by an international collaboration of editors.


https://doi.org/10.18429/JACoW-LINAC2022-TUPOPA25
Title Design, Manufacturing, Assembly, Testing, and Lessons Learned of the Prototype 650 MHz Couplers
Authors
  • J. Helsper, S.K. Chandrasekaran, F. Furuta, B.M. Hanna, S. Kazakov, J.P. Ozelis, K.S. Premo, N. Solyak, G. Wu
    Fermilab, Batavia, Illinois, USA
Abstract Six 650 MHz high-power couplers will be integrated into the prototype High Beta 650 MHz (HB650) cryomodule for the PIP-II project at Fermilab. The design of the coupler is described, including design optimizations from the previous generation. This paper then describes the coupler life-cycle, including manufacturing, assembly, testing, conditioning and the lessons learned at each stage.
Funding Work supported, in part, by the U.S. Department of Energy, Office of Science, Office of High Energy Physics, under U.S. DOE Contract No. DE-AC02-07CH11359.
Paper download TUPOPA25.PDF [10.912 MB / 4 pages]
Poster download TUPOPA25_POSTER.PDF [2.695 MB]
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Conference LINAC2022
Series International Linear Accelerator Conference (31st)
Location Liverpool, UK
Date 28 August-02 September 2022
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Peter McIntosh (STFC DL, Daresbury, UK); Graeme Burt (Lancaster Univ., Lancaster, UK); Robert Apsimon (Lancaster Univ., Lancaster, UK); Volker R.W. Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-215-8
Online ISSN 2226-0366
Received 24 August 2022
Revised 25 August 2022
Accepted 29 August 2022
Issue Date 02 September 2022
DOI doi:10.18429/JACoW-LINAC2022-TUPOPA25
Pages 462-465
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 4.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.