Abstract
This research deals with a mode of brittle intergranular fracture in which a surface-adsorbed embrittling element is driven into a grain boundary as a result of the application of a tensile stress across the boundary. A Cu-8%Sn alloy has been employed to explore this phenomenon, since tin is a surface-active element, and this alloy is known to suffer intergranular weakness at elevated temperatures. Intergranular cracking occurred by brittle, discontinuous crack advance at 265°C in vacuum with an average rate of 0.1μm/sec. This behavior is analogous to sulfur-induced stress-relief cracking in steels and several cases of liquid-metal embrittlement, suggesting that this phenomenon has a generic nature.
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Aknowledgements
This work has been supported by the Office of Basic Energy Sciences of the Department of Energy under grant no. DE-FG02-87ER45290, a fellowship (to DB) from the American Welding Society, and the Penn NSF-sponsored MRL through its central facilities. The assistance of Dr. A. Radin is greatly appreciated.
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Bika, D., McMahon, C.J. Diffusion-Controlled Decohesion Using a Cu-Sn Alloy as a Model System. MRS Online Proceedings Library 238, 399–404 (1991). https://doi.org/10.1557/PROC-238-399
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DOI: https://doi.org/10.1557/PROC-238-399