Skip to main content
SpringerLink
Log in

Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy

  • Published:
Journal of Materials Research Aims and scope Submit manuscript

Abstract

Ternary electroless nickel, NiXP, films were produced by adding salts of Mo, Re, Tl, Cu, W, Co, Fe, Zn, and Mn to conventional electroless Ni baths and subsequently reacted with Sn-3.5Ag solder. From the full width at the half maximum (FWHM) data, as-plated NiXP films can be categorized into two groups: one is close to the FWHM value of nanocrystalline Ni5P film and the other is close to amorphous Ni9P film. Alloying elements in the electrolessly plated under-bump metallurgy that effectively suppressed intermetallic compound (IMC) spalling were Mn, Zn, Re, Fe, and W, whereas Tl exacerbated spalling. The roles of Cu, Mo, and Co were less clear due to a lack of data. Based on scanning electron microscopy observations, a spalling map was presented, which showed elemental demarcation lines of IMC spalling in the X-P coordinates.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

TABLE I.
FIG. 1.
FIG. 2.
FIG. 3.
FIG. 4.
FIG. 5.
FIG. 6.

Similar content being viewed by others

References

  1. S.K. Kang, R.S. Rai, and S. Purushothaman: Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders. J. Electron. Mater. 25, 1113 (1996).

    Article  CAS  Google Scholar 

  2. Y.K. Jee, J. Yu, and Y.H. Ko: Effects of Zn addition on the drop reliability of Sn–3.5Ag–xZn/Ni(P) solder joints. J. Mater. Res. 22, 2776 (2007).

    Article  CAS  Google Scholar 

  3. J.Y. Kim, Y.C. Sohn, and J. Yu: Effect of Cu content on the mechanical reliability of Ni/Sn-3.5Ag system. J. Mater. Res. 22, 770 (2007).

    Article  CAS  Google Scholar 

  4. H. Min, Z. Chen, and G. Qi: Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization. Acta Mater. 52, 2047 (2004).

    Article  Google Scholar 

  5. Y.K. Jee, Y.H. Ko, and J. Yu: Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad. J. Mater. Res. 22, 1879 (2007).

    Article  CAS  Google Scholar 

  6. J.W. Yoon, S.W. Kim, and S.B. Jung: IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate. J. Alloys Compd. 392, 247 (2005).

    Article  CAS  Google Scholar 

  7. Y.C. Sohn, J. Yu, S.K. Kang, D.Y. Shih, and T.Y. Lee: Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni–P metallization. J. Mater. Res. 19, 2428 (2004).

    Article  CAS  Google Scholar 

  8. Y.C. Sohn and J. Yu: Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection. J. Mater. Res. 20, 1931 (2005).

    Article  CAS  Google Scholar 

  9. H.K. Kim, K.N. Tu, and P.A. Totta: Ripening-assisted asymmetric spalling of Cu-Sn compound sheroids in solder joints on Si wafers. Appl. Phys. Lett. 68, 2204 (1996).

    Article  CAS  Google Scholar 

  10. A.A. Liu, H.K. Kim, K.N. Tu, and P.A. Totta: Spalling of Cu6Sn5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films. J. Appl. Phys. 80, 2774 (1996).

    Article  CAS  Google Scholar 

  11. J.F. Li, S.H. Mannan, M.P. Clode, D.C. Whalley, and D.A. Hutt: Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects. Acta Mater. 54, 2907 (2006).

    Article  CAS  Google Scholar 

  12. S.K. Kang, D.Y. Shih, and Y.C. Sohn: Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present. US Patent 2006/0024943 A1 (February 2, 2006).

  13. F. Pearlstein and R.F. Weightman: Electroless deposition of nickel alloys. Electrochem. Technol. 6, 427 (1968).

    CAS  Google Scholar 

  14. G.O. Mallory and T.R. Horhn: Electroless deposition of ternary alloys. Plat. Surf. Finish. 66, 40 (1979).

    CAS  Google Scholar 

  15. J. Hsu and K. Lin: Enhancement in the deposition behavior and deposit properties of electroless Ni-Cu-P. J. Electrochem. Soc. 150, C653 (2003).

    Article  CAS  Google Scholar 

  16. A.F. Schmeckenbecher: Chemical nickel-iron films. J. Electrochem. Soc. 113, 778 (1966).

    Article  CAS  Google Scholar 

  17. T.S.N. Sankara, S. Selvakumar, and A. Stephen: Electroless NiCoP ternary alloy deposits: Preparation and characteristics. Surf. Coat. Technol. 172, 299 (2003).

    Google Scholar 

  18. M. Bouanani, F. Cherkaoui, R. Fratesi, G. Roventi, and G. Barucca: Microstructural characterization and corrosion resistance of Ni-Zn-P alloys electrolessly deposited from a sulphate bath. J. Appl. Electrochem. 29, 637 (1999).

    Article  CAS  Google Scholar 

  19. T. Osaka, N. Kasai, I. Koiwa, and F. Goto: A study on electroless plating of cobalt alloy films for perpendicular recording. J. Electrochem. Soc. 130, 790 (1983).

    Article  CAS  Google Scholar 

  20. K. Chen, C. Liu, D.C. Whalley, and D.A. Hutt: Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnects, in Proceedings of the 1st Electronics Systemintegration Technology Conference, Vol. 1, September 5-7, 2006, pp. 421–427.

    Article  Google Scholar 

  21. D.M. Jang and J. Yu: Tungsten alloying of the Ni(P) films and the reliability of Sn-3.5Ag/NiWP solder joints. J. Mater. Res. 26, 889 (2011).

    Article  CAS  Google Scholar 

  22. F.C. Tai, K.J. Wang, and J.G. Duh: Application of electroless Ni–Zn–P film for under-bump metallization on solder joint. Scr. Mater. 61, 748 (2009).

    Article  CAS  Google Scholar 

  23. P. Ratchev, R. Labie, and E. Beyne: Nanohardness study of CoSn2 intermetallic layers formed between Co UBM and Sn flip-chip, in Proceedings of 6th Electronic Packaging Technology Conference, December 8-10, 2004, pp. 339–342.

    Google Scholar 

  24. M. He, Z. Chen, and G. Qi: Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization. Acta Mater. 52, 2047 (2004).

    Article  CAS  Google Scholar 

  25. Y. Yang, Y.J. Lim, A. Kumar, T.K. Lee, and Z. Chen: Interface reactions and shear strength of lead-free Sn-3.5Ag solder with Ni-W-P metallization, in Proceedings of the 9th Electronic Packaging Technology Conference, December 10-12, 2007, pp. 527–532.

    Google Scholar 

Download references

Acknowledgments

This work was supported by a National Research Foundation of Korea grant funded by the South Korean Government Ministry of Education, Science and Technology (MEST) (Grant No. 2010-0000862).

Author information

Authors and Affiliations

  1. Samsung Electronics, Hwasung-City, Gyeongii-Do, 445-701, Korea

    Dong Min Jang

  2. Electronic Packaging Laboratory, Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Yuseong-gu, Daejeon, 305-701, Korea

    Jin Yu

Authors
  1. Dong Min Jang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Jin Yu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jin Yu.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Jang, D.M., Yu, J. Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy. Journal of Materials Research 26, 3032–3037 (2011). https://doi.org/10.1557/jmr.2011.371

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/jmr.2011.371

Search

Navigation