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A new method to study cyclic deformation of thin films in tension and compression

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Abstract

In this paper, a new method to study cyclic plastic deformation in thin metal films is presented. Cu films were deposited onto compliant substrates allowing the film to be subjected to tensile and compressive stresses on loading and unloading of the film/substrate composite. The film stress was measured in situ by x-ray diffraction. First results lend to characteristic stress-strain hysteresis curves, indicative of fatigue processes in small dimensions.

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Authors and Affiliations

  1. Max-Planck-Institut für Metallforschung, Seestrasse 92, D-70174, Stuttgart, Germany

    M. Hommel, O. Kraft & E. Arzt

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  1. M. Hommel
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  2. O. Kraft
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  3. E. Arzt
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Hommel, M., Kraft, O. & Arzt, E. A new method to study cyclic deformation of thin films in tension and compression. Journal of Materials Research 14, 2373–2376 (1999). https://doi.org/10.1557/JMR.1999.0317

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  • DOI: https://doi.org/10.1557/JMR.1999.0317

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