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Tensile Strength and Fracture Toughness of Surface Micromachined Polycrystalline Silicon Thin Films Prepared Under Various Conditions

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Abstract

A new tensile tester for thin films was developed to evaluate the reliability of the microelectro- mechanical devices. This tester uses the grip that fixes a thin film specimen to a probe by electrostatic force. We applied this tester for polycrystalline silicon (poly-Si) thin films prepared under various conditions. The microstructure of the film is controlled by the crystallizing temperature. The process conditions and the microstructures that contribute to the strength of poly-Si film are identified by the tensile strength and the fracture toughness. The mean tensile strength of each specimen size ranges from 1.8 to 3.7 GPa, and the fracture toughness calculated from the strength of the notched specimen ranges from 1.9 to 4.5 MN/m3/2. The 1000°C annealed film has higher strength and toughness than the other films because of the high annealing temperature and the small grain size. The contributions to the strength are evaluated by the additional annealing at 1000°C for the low temperature annealed films.

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References

  1. A. J. Griffin Jr., F. R. Brotzen, and C. F. Dunn, Thin Solid Films 150, p.237–244 (1987).

    CAS  Google Scholar 

  2. W. N. Sharpe Jr., B. Yuan and R. Vaidyanathan, SPIE Proceedings 2880, p. 78–91 (1996).

    CAS  Google Scholar 

  3. T. Tsuchiya, O. Tabata, J. Sakata, and Y. Taga, Trans. of IEEJ Sensors and Micromachines Soc., 116-E (10), p. 441–446 (1996).

    Google Scholar 

  4. T. Tsuchiya, O. Tabata, J. Sakata, and Y. Taga, Proceedings of 10th IEEE International Workshop on Micro Electro Mechanical Systems (Nagoya, Japan, 1997), p. 529–534.

    Google Scholar 

  5. M. K. Hatalis and D. W. Greve, J. Appl. Phys. 63 (7), p.2260–2266 (1988).

    CAS  Google Scholar 

  6. B. A. Boxall, Solid-State Electronics 20, p. 873–874 (1977).

    CAS  Google Scholar 

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Acknowledgments

The authors would like to thank Atsuko Inoue for experimental assistance and SEM observation.

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Authors and Affiliations

  1. Toyota Central Research and Development Laboratories, Inc., Nagakute Aichi, 480-11, Japan

    Toshiyuki Tsuchiya, Jiro Sakata & Yasunori Taga

Authors
  1. Toshiyuki Tsuchiya
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  2. Jiro Sakata
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  3. Yasunori Taga
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Tsuchiya, T., Sakata, J. & Taga, Y. Tensile Strength and Fracture Toughness of Surface Micromachined Polycrystalline Silicon Thin Films Prepared Under Various Conditions. MRS Online Proceedings Library 505, 285–290 (1997). https://doi.org/10.1557/PROC-505-285

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  • DOI: https://doi.org/10.1557/PROC-505-285

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