Abstract
Nano-indentation testing has been used to quantitatively assess the adhesion of thin copper films, sputtered to thicknesses of 150 nm to 1500 nm. Copper films of low residual stress were deposited via RF diode cathode sputtering onto SiO2/Si substrates. Overlayers of DC magnetron sputtered high residual stress tungsten, 850 nm thick, were additionally used to provide a driving force for delamination. All films tested exhibited buckle-driven delamination, from which the interfacial toughness was estimated to be 0.2–2 J/m2, which is comparable to the thermodynamic work of adhesion. The use of an overlayer requires extensions of existing models, but otherwise does not change the interfacial adhesion, allowing measurements of films that would not otherwise delaminate.
Similar content being viewed by others
References
J.R. Rice, J. Appl. Mech., 55, 98–103 (1988).
H.C. Cao and A.G. Evans, Acta metall., 39, 2997 (1991).
A.G. Evans and B.J. Dalgleish, Mater. Sci. & Eng., A162, 1 (1993).
A.G. Evans, M. Riihle, B.J. Dalgleish, and P.G. Charalambides, Mater. Sci. & Eng., A126, 53–64 (1990).
M.D. Thouless, A.G. Evans, M.F. Ashby, and J.W. Hutchinson, Acta metall., 35, 1333 (1987).
Z. Suo and J.W. Hutchinson, Int. J. of Frac, 43, 1 (1990).
J.W. Hutchinson, M.D. Thouless, and E.G. Liniger, Acta metall., 40, 295 (1992).
M.D. Thouless, J.W. Hutchinson, and E.G. Liniger, Acta metall., 40, 2639–2649 (1992).
A.G. Evans, M.D. Drory, and M.S. Hu, J. Mater. Res., 3, 1043–1049 (1988).
H.M. Jensen, J.W. Hutchinson, and K.-S. Kim, Int. J. Sol. Struc, 26, 1099–1114 (1990).
H.M. Jensen and M.D. Thouless, Int. J. Sol. Struc, 30, 779 (1993).
H.C. Cao and A.G. Evans, Mechanics of Materials, 7, 295–304 (1989).
D.B. Marshall and A.G. Evans, J. Appl. Phys., 56, 2632–2638 (1984).
J.W. Hutchinson and Z. Suo, Mixed mode cracking in layered materials, in Advances in Applied Mechanics (Academic Press, Inc., New York, 1992), p. 63–169.
A. Bagchi, G.E. Lucas, Z. Suo, and A.G. Evans, J. Mater. Res., 9, 1734 (1994).
N.R. Moody, R.Q. Hwang, J.E. Angelo, S. Venkataraman, and W.W. Gerberich, submitted to Acta Materialia (1997).
D.F. Bahr, J.W. Hoehn, N.R. Moody, and W.W. Gerberich, submitted to Acta Materialia (1997).
M. Ohring, in The Materials Science of Thin Films, (Academic Press, New York, 1992).
G.C. Stoney, Proc. R. Soc. London, A82, 172 (1909).
M. A. Meyers and K.K. Chawla, in Mechanical Metallurgy- Principles and Applications (Prentice-Hall Inc., Englewood Cliffs, NJ, 1984).
W.C. Oliver and G.M. Pharr, J. Mater. Res., 7, 564 (1992).
C. Rossington, A.G. Evans, D.B. Marshall, and B.T. Khuri-Takub, J. Appl. Phys., 56, 2639–2644 (1984).
T.F. Page and S.V. Hainsworth, Surfaces and Coatings, 561, 201 (1993).
L.G. Rosenfield, J.E. Ritter, T.J. Lardner, and M.R. Lin, J. Appl. Phys., 67, 3291–3296 (1990).
J.L. Loubet, J.M. Georges, and P. Kapsa, in Proc. of the 16th Leeds-Lyon Symposium on Tribology, edited by D. Dowson, (Elsevier, Lyon, France, 1990), p. 429.
F.P. Beer and E.R. JohnstonJr, in Mechanics of Materials (McGraw-Hill, New York, 1981).
B.D. Agarwal and L.J. Broutman, in Analysis and Performance of Fiber Composites (John Wiley & Sons, Inc., 1990).
K.L. Johnson, in Contact Mechanics (Cambridge University Press, New York, 1985).
T.S. Oh, J. Rodel, R.M. Cannon, and R.O. Ritchie, Acta metall., 36, 2083 (1988).
J.R. Rice and J.S. Wang, Mater. Sci. & Eng., A107, 23 (1989).
D.R. Lide, in 73rd ed., (CRC Press, 1993), p. Pages.
B. Lawn, in Fracture of Brittle Solids (Cambridge University Press, 1993).
J.W. Hoehn, Ph.D. Thesis, University of Minnesota, 1996.
Acknowledgement
M. Kriese thanks the University of Minnesota Microtechnology Laboratory and in particular Tony Whipple for his tremendous help with sample preparation, as well D. Bahr, D. Kramer and M. deBoer for their valuable assistance. M. Kriese, N.R. Moody and W.W. Gerberich gratefully acknowledge the support of the Center for Interfacial Engineering at the University of Minnesota under grant NSF/CDR-8721551 and the Department of Energy under DOEs/DEFG02/96ER45574.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Kriese, M.D., Moody, N.R. & Gerberich, W.W. Adhesion Assessment of Copper Thin Films. MRS Online Proceedings Library 473, 39–49 (1997). https://doi.org/10.1557/PROC-473-39
Published:
Issue Date:
DOI: https://doi.org/10.1557/PROC-473-39