Abstract
Temperatures for lamp-heated rapid thermal processing of wafers with various back-side films were controlled by a Lucent Technologies pyrometer which uses a/c lamp ripple to compensate for emissivity. Process temperatures for anneals of arsenic and boron implants were inferred from post-anneal sheet resistance, and for rapid thermal oxidation, from oxide thickness. Results imply temperature control accuracy of 12°C to 17°C at 3 standard deviations.
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Fiory, A.T. Rapid Thermal Annealing and Oxidation of Silicon Wafers with Back-Side Films. MRS Online Proceedings Library 470, 49–56 (1997). https://doi.org/10.1557/PROC-470-49
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DOI: https://doi.org/10.1557/PROC-470-49