Abstract
We describe a new technique for producing large-grain, poly-Si thin films on low-cost glass substrates for solar cell applications. A layer of fine-grain poly-Si is deposited on metal-coated substrate followed by a grain enhancement using optical/thermal annealing at low temperatures (∼ 500 °C). The results show that in thin-layer silicon, less than 3 microns, grains can be formed in a short time (few minutes) with grain sizes larger than the film thickness. The possible mechanisms involved in this process are also presented.
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Acknowledgement
The authors would like to thank Kim Jones for TEM work and David Ginley for many valuable suggestions.
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Sopori, B.L., Alleman, J., Chen, W. et al. Grain Enhancement of Thin Silicon Layers Using Optical Processing. MRS Online Proceedings Library 470, 419–424 (1997). https://doi.org/10.1557/PROC-470-419
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DOI: https://doi.org/10.1557/PROC-470-419