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Thin Film Adhesion Study in Microelectronic Packaging

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Abstract

Fracture energy (Ga) of BPDA-PDA polyimide (PI) on modified and unmodified Si surfaces was measured by the “blister” test as a function of final cure temperature. It is proven quantitatively that surface modification prior to thin film deposition enhances adhesion. Metal adhesion to PI was also measured by the same method. Reproducibility of the data was found to be exceptionally good for both cases. The linear elastic model is quite valid for the test of thin film adhesion. Therefore, it is believed that this test is best suited for Ga measurements in the study of thin film adhesion for microelectronic packaging.

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Authors and Affiliations

  1. Department of Electrical Engineering and Microelectronics Sciences Laboratories, Columbia University, New York, NY, 10027

    H. S. Jeong, M. B. Freiler & R. C. White

  2. Department of Chemical Engineering, Columbia University, New York, NY, 10027

    Y. Z. Chu & C. Durning

Authors
  1. H. S. Jeong
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  2. Y. Z. Chu
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  3. M. B. Freiler
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  4. C. Durning
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  5. R. C. White
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Jeong, H.S., Chu, Y.Z., Freiler, M.B. et al. Thin Film Adhesion Study in Microelectronic Packaging. MRS Online Proceedings Library 239, 547–552 (1991). https://doi.org/10.1557/PROC-239-547

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  • DOI: https://doi.org/10.1557/PROC-239-547

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