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Latent Patterned Surface Metallization of Silver Ion-Doped Polyimide Films

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Abstract

A straightforward ambient temperature route to the fabrication of surface silver-metallized polyimide films is described. Silver(I) trifluoromethane sulfonate and a polyimide, derived from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and an equimolar amount of 4,4'-oxydianiline (ODA) and 3,5-diaminobenzoic acid (DABA), were dissolved together in dimethylacetamide. Silver(I)-doped films were prepared at thicknesses of 25-50 microns and depleted of solvent by evaporation. The silver(I)-containing films were then treated with aqueous reducing agents, which brought forth silvered films exhibiting conductivity on the order of bulk polycrystalline silver and good specular reflectivity.

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Authors and Affiliations

  1. Departments of Chemistry and Biology, College of William and Mary, Williamsburg, VA, 23187, USA

    Luke M. Davis, Tyler S. Stukenbroeker, C.J. Abelt, J.L. Scott, E. Orlova & D.W. Thompson

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  1. Luke M. Davis
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  2. Tyler S. Stukenbroeker
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  3. C.J. Abelt
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  4. J.L. Scott
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  5. E. Orlova
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  6. D.W. Thompson
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Davis, L.M., Stukenbroeker, T.S., Abelt, C. et al. Latent Patterned Surface Metallization of Silver Ion-Doped Polyimide Films. MRS Online Proceedings Library 1192, 8–14 (2009). https://doi.org/10.1557/PROC-1192-PP11-05

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  • DOI: https://doi.org/10.1557/PROC-1192-PP11-05

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