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Contamination Control in SIMOX Implanters

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Abstract

The Semiconductor Equipment Division of Eaton has, for the past year, supplied Simox wafers to various companies and laboratories throughout the world. A review will be presented of the operation in a production mode of the NV-200 Oxygen Implanter. Improvements in the production version will be related to both particulate counts and elemental contamination on the wafers. The addition of a polysilicon liner in the beamline has greatly reduced the heavy metal and carbon contamination levels in the machine. Historical Sims and Auger data will be presented to show these effects. The most recent production machine is operating on the manufacturing floor. Sims data from wafers implanted in October 1987 will be presented.

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References

  1. L. Jastrzebski, G. Cullen, SRI Corporation. Private Communication

  2. Supported in part by Air Force contract #F19628-86-C-0068.

  3. All SIMS work was performed by C. Evans Associates. Graphs and figure preparation is courtesy of B. Wilson, Hughes Aircraft Corp.

  4. Private communication B. Wilson, Hughes Aircraft.

  5. C.E. Daniel Chen paper H9.2 this conference proceedings.

  6. P.K. Vasudev late news paper H10.3 this conference proceedings.

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Cordts, B., Guerra, M. Contamination Control in SIMOX Implanters. MRS Online Proceedings Library 107, 147–150 (1987). https://doi.org/10.1557/PROC-107-147

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  • DOI: https://doi.org/10.1557/PROC-107-147

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