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Potential of Ag Interconnect and Contact Metallization for Various Applications via Cu Additions

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Abstract

The thermal stability of Ag(Cu) alloy thin films on indium tin oxide (ITO) has been investigated and compared to that of pure Ag thin films on ITO. Atomic force microscopy and X-ray diffraction results of annealed films show differences in the evolution of surface morphology and texture with annealing. The presence of Cu atoms in the silver impacts the surface energy and surface diffusion. This results in Ag and Ag(Cu) alloy having very different surface morphology and crystallographic texture. The enhanced texture and thermal stability of the Ag(Cu) alloy constitute its potential use contact as material for MOSFET and for flip-chip light-emitting diodes.

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Authors and Affiliations

  1. School of Materials, Arizona State University, Tempe, AZ, 85287-8706, USA

    Hauk Han, Yeongseok Zoo, James W. Mayer & Terry L. Alford

  2. Flexible Display Center at ASU, Arizona State University, Tempe, AZ, 85287, USA

    Hauk Han & Terry L. Alford

Authors
  1. Hauk Han
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  2. Yeongseok Zoo
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  3. James W. Mayer
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  4. Terry L. Alford
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Han, H., Zoo, Y., Mayer, J.W. et al. Potential of Ag Interconnect and Contact Metallization for Various Applications via Cu Additions. MRS Online Proceedings Library 990, 824 (2006). https://doi.org/10.1557/PROC-0990-B08-24

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  • DOI: https://doi.org/10.1557/PROC-0990-B08-24

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