Abstract
Fatigue in damascene copper line has been investigated by using alternating currents to generate cyclic temperatures and stresses/strains. Interconnects using beyond 65 nm node design rules and materials have been studied. We demonstrate that cyclic thermal strains lead to Cu or Cu/Co-based cap surface modification and open circuits in Cu lines during the application of an alternating electrical current. We underline that the narrower the copper lines are, the more reliable they are and the major role of the cap layer to improve the Cu lines reliability. Moreover, a statistical approach is presented in this paper in order to discuss about the thermal fatigue associated distribution model (exponential, lognormal and Weibull distributions). At present, the lognormal distribution seems to be the most appropriate one.
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Moreau, S., Maitrejean, S. & Passemard, G. Fatigue of Damascene Copper Lines under AC Loading. MRS Online Proceedings Library 990, 717 (2006). https://doi.org/10.1557/PROC-0990-B07-17
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DOI: https://doi.org/10.1557/PROC-0990-B07-17